Featured
Latest from CIE Online
- Multi-protocol modules support WiFi, Bluetooth and mesh networking standards Tria Technologies, an Avnet company specializing in embedded compute boards, systems and HMIs, has announced the availability of two new wireless modules, the SPB611 and SPB209. These modules support multiple short-range protocols […]
- New challenge invites engineers and makers to bring intelligence to the production line element14, an Avnet Community, has launched its latest design competition, inviting engineers, makers and technology enthusiasts to develop smart industry projects focused on production monitoring, uptime optimization […]
- New TOPSwitchGaN ICs more than double power output, reducing system cost, complexity, and design time Power Integrations, a specialist in high-voltage integrated circuits for energy-efficient power conversion, has introduced what it said is “a breakthrough in flyback topology extending the […]
- New Measurement Technology Contributes to Building Communication Infrastructure for AI and Cloud Era ANRITSU CORPORATION has developed, what it has described as, “the industry’s first*1 Multi Channel Fiber Tester MT9100A, enabling transmission quality evaluation of multicore fibers supporting next-generation high-capacity […]
- With SuperFlash memory, Mythic’s APU achieves 120 TOPs/watt performance for low-power AI inferencing Mythic has chosen memBrain neuromorphic hardware intellectual property (IP) from Microchip Technology’s Silicon Storage Technology (SST) subsidiary for its next-generation edge to enterprise Analog Processing Units (APUs). Mythic […]
- Global semiconductor specialist Analog Devices has announced the opening of its new advanced manufacturing facility in Thailand, further strengthening its advanced manufacturing and test capacity while expanding resilient, sustainable semiconductor production in the Asia-Pacific region. The expansion builds on ADI’s […]
- Partnership expands Astute’s connector and interconnect portfolio, delivering high-performance solutions for mission-critical aerospace and defence applications. Astute Group has signed a distribution agreement with AEF Solutions, a UK-based manufacturer specialising in custom interconnect systems, rugged cable assemblies, and high-reliability connectors. […]
- The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families Microchip Technology has announced its BZPACK mSiC® power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse […]

Join our Growing Database!
Simply sign-up, pick a package that’s right for you, fill in your details and our sales team will take you the rest of the way.
|
|
|




