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News from Components in Electronics

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Toshiba Memory Europe announces 96-layer BiCS FLASH development with QLC technology

Toshiba Memory Europe GmbH today announced that it has developed a prototype sample of a 96-layer BiCS FLASH, memory device using its proprietary 3D flash quad level cell (QLC) technology that boosts single-chip memory capacity to the highest level yet… Read more

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TI’s LMZM2360x step-down power modules, now at Mouser, offer high efficiency and industry-leading space savings

Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation,is now stocking LMZM23600 and LMZM23601 step-down DC-DC power modules from Texas Instruments (TI). Housed in a compact, 3.8 mm × 3 mm × 1.6 mm MicroSiP package, the modules… Read more

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Rittal publishes UL regulations advice

Rittal embraces the need for a high degree of responsibility for the safety of users and the electrical equipment its enclosures are designed to protect. As such the company has a policy of always being on the front foot when… Read more

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Farnell element14 prevents 83 tonnes of waste going to landfill with successful recycling scheme

Farnell element14, the development distributor, is redirecting over 10 tonnes of waste from landfill each year through its recycling scheme. The scheme has recycled almost two million reels and over 200,000 waffle trays, amounting to 83 tonnes of avoided waste… Read more

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Analog Devices’ DSP creates internal and external engine sound for electric and hybrid electric vehicles

Analog Devices, Inc. (ADI) today introduced an embedded system for generating engine sound for electric (EV) and hybrid electric vehicles (HEV). The ADSP-BF706 digital signal processor and Electric Vehicle Warning Sound System (EVWSS) firmware enables automobile manufacturers in North America… Read more

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Enhanced early static checks of Finite State Machines and Xilinx IP-based designs

Aldec, Inc., an industry leader in electronic design verification, has expanded the rule-checking capabilities of its popular ALINT-PRO tool in response to increasing verification challenges for complex, large-scale FPGA and ASIC designs. These enhanced capabilities include twice as many FSM checks… Read more

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Development time slashed for Cortex-M4 applications using displays

Inelco Hunter has announced the availability of a Powertip Development Board for Cortex-M4 processor applications where a display screen interface is required. The board is tailor-made for Cortex-M4 STM32F429IGT6 processors and can provide huge cost-savings by slashing development time. The Development Board… Read more

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Callen-Lenz and Lynx Software Technologies team to accelerate time to market for air mobility

UK based flight control specialists Callen-Lenz and California’s Lynx Software Technologies, the world leader in open, mixed criticality and secure system development, today announce a strategic teaming to address the fast-developing air mobility, personal air vehicle and certified unmanned air… Read more

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Cramlington PCB assembly services business secures globally recognised industry standard

One of the region’s leading manufacturing companies has become one of the few businesses within the North East to secure an internationally recognised standard. Hindley Circuits – based in Cramlington and recognised for providing PCB electronic assembly services – has… Read more

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Farnell element14’s IoT Hub asks “What’s going on in the Internet of Things”, providing new insight and technical articles for IoT developers

Farnell element14, the development distributor, has added further new content to its IoT Hub. The IoT hub, available in English, French, German and Polish, contains a variety of IoT news items and feature stories, case studies, products, and interviews, as… Read more

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